PSG Laser Solutions for Advanced Packaging
Achieving both high precision and flexibility. The new generation "DR20x0 / DR30x0" series is born.
The new generation of PSG "DR20x0 / DR30x0" realizes the optimal solution for advanced PCB packaging: 1. ABF substrate drilling 2. Ultra-HDI PCB fine drilling 3. IC substrate drilling 4. Rigid substrate processing 5. Cavity creation 6. Laser trenching
- Company:WorldLink Co., Ltd.
- Price:Other